3M PTFE film tape 5498 uses an extruded PTFE film backing. This tape offers an extremely low coefficient of friction which, in combination with a pressure sensitive rubber adhesive, creates a smooth, non-stick surface over a variety of substrates to assist in mold release applications where a non-silicone tape is required. 3M PTFE film tape 5498 can help reduce stick of composite resins to mold surfaces, even under a wide range of temperatures (40 to 350 °F) and pressures. - 3M PTFE film tape 5498 has a film backing with a non-silicone rubber adhesive. This tape as a quick and easy release medium between surfaces where pressure, temperature changes and other factors may create a measure of adhesion, particularly in composite bonding applications.