MFR #:70016048186
EIS #:3M5419X.625
UPC #:00021200735769
MFR #:70016048186
EIS #:3M5419X.625
UPC #:00021200735769
Out of Stock
Min Qty:1
|Qty Increment:1
Pack:12/Case
more info
At room temperature the properties of polyimide and polyester film are similar. However, as the temperature increases or decreases, the properties of the polyimide film are less affected than polyester.
3M low static polyimide film tape 5419 is a translucent, polyimide film-backed silicone adhesive tape with unique and extremely low electrostatic discharge properties. Use 3M tape 5419 to mask printed circuit boards during wave solder or solder dip process.
$75.38 / Roll
Pack: 12/Case
Min Qty:1
|Qty Increment:1
Pack:12/Case
more info
At room temperature the properties of polyimide and polyester film are similar. However, as the temperature increases or decreases, the properties of the polyimide film are less affected than polyester.
3M low static polyimide film tape 5419 is a translucent, polyimide film-backed silicone adhesive tape with unique and extremely low electrostatic discharge properties. Use 3M tape 5419 to mask printed circuit boards during wave solder or solder dip process.
Product Options
Showing 8 out of 10 options
Width: 2 Inch | EIS Part #: 3M5419X2 | $ / Roll Pack: 6/Case | ||
Width: 1 Inch | EIS Part #: 3M5419X1 | $ / Roll Pack: 9/Case | ||
Width: 0.875 Inch | EIS Part #: 3M5419X.875 | $ / Roll Pack: 9/Case | ||
Width: 0.75 Inch | EIS Part #: 3M5419X.75 | $ / Roll Pack: 12/Case | ||
Width: 0.625 Inch | EIS Part #: 3M5419X.625 | $ / Roll Pack: 12/Case | ||
Width: 0.5 Inch | EIS Part #: 3M5419X.5 | $ / Roll Pack: 18/Case | ||
Width: 0.375 Inch | EIS Part #: 3M5419X.375 | $ / Roll Pack: 24/Case | ||
Width: 0.25 Inch | EIS Part #: 3M5419X.25 | $ / Roll Pack: 36/Case |
- Attributes
- Applications
- Features
Attributes
General Information
Item NameFilm Tape
Trade Name3M
Series5419
General Features
Shelf Life36 Months
Storage Temperature16 to 27 deg C
TypeLow Static
Design & Construction
Adhesive TypeSilicone
Applicable MaterialSteel
Backing MaterialPolyimide
ColorGold
Performance Details
Adhesive Strength20.0
Flame RetardantYes
Tensile Strength33.0
Electrical Properties
Dielectric Strength7000.0
Physical Properties
Elongation60%
Length36 Yard
Thickness2.7
Width0.625 Inch
Core Size3 Inch
Environmental Condition
Temperature Rating260 °C
Applications
- For Printed Circuit Boards during Wave Solder or Solder Dip Process, Fabrication of Parts
Features
- Polyimide film does not soften at elevated temperatures, thus the film provides an excellent release surface at elevated temperatures
- Gold tab protection during wave solder of printed circuit boards
- Employs a proprietary technology that results in extremely low electrostatic discharge at unwind and removal from the PWB
- 10^6 ohm insulation resistance
- Temperature rating of -73 to 260 °C