Von Roll/John C Dolph Dolphon® CB-1069 Epoxy Potting And Casting Resin, 12 lb/1 gal, Black
MFR #:198237
EIS #:DOLCB106912LB
MFR #:198237
EIS #:DOLCB106912LB
In Stock
Min Qty:1
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CB-1069 Epoxy Potting And Casting Resin, Epoxy Base Type, Room Temperature Cure Type, 12 - 13 lb/gal At 77 °F Density, 405 V/Mil (ASTM D-149, 1/8 Inch Specimen) Dielectric Strength, 19900 psi (ASTM D790) Flexural Strength, 80 Shore D (After 7 Days At Room Temperature Cure) Hardness, 100 Weight Mixing Ratio, 12000 psi (ASTM D-638) Tensile Strength, 3.5 BTU/HR/ft²/Inch/°F (ASTM 3111) Thermal Conductivity, 15500 - 24500 cps At 77 °F Brookfield (Mixed) Viscosity.
Von Roll/John C Dolph Dolphon® CB-1069 is a general purpose, high thermal conductivity, black epoxy casting and potting resin for use in all types of electrical and electronic assemblies.
$48.14 / US pound
Min Qty:1
|Qty Increment:1
CB-1069 Epoxy Potting And Casting Resin, Epoxy Base Type, Room Temperature Cure Type, 12 - 13 lb/gal At 77 °F Density, 405 V/Mil (ASTM D-149, 1/8 Inch Specimen) Dielectric Strength, 19900 psi (ASTM D790) Flexural Strength, 80 Shore D (After 7 Days At Room Temperature Cure) Hardness, 100 Weight Mixing Ratio, 12000 psi (ASTM D-638) Tensile Strength, 3.5 BTU/HR/ft²/Inch/°F (ASTM 3111) Thermal Conductivity, 15500 - 24500 cps At 77 °F Brookfield (Mixed) Viscosity.
Von Roll/John C Dolph Dolphon® CB-1069 is a general purpose, high thermal conductivity, black epoxy casting and potting resin for use in all types of electrical and electronic assemblies.
- Attributes
- Features
- Applications
- Documents
Attributes
General Information
Item NameEpoxy Potting and Casting Resin
Trade NameDolphon®
SeriesDolphon® CB-1069
Design & Construction
Base TypeEpoxy
ColorBlack
Cure TypeRoom Temperature
Performance Details
Tensile Strength12000 psi
Flexural Strength19900 psi
Chemical Properties
Viscosity15500 cP
Mixing Ratio100 Weight
Electrical Properties
Dielectric Strength405 V/mil
Physical Properties
Container Size12 lb
Container TypeCan
Hardness80 Shore D (After 7 Days at Room Temperature Cure)
Features
- Choice of room temperature curing or heat curing reactors available
- Excellent thermal conductivity
- Superior electrical properties
- Low shrinkage
- Superior water and chemical resistance
- Good impact resistance
- 7.5 x 10^14 ohm surface resistivity
- 8.9 x 10^15 ohm-cm volume resistivity
- 21,000 psi (ASTM D-695) compressive strength
- 0.02 (at 100 °F, 95% R.H. (gms/ft^2/24 hrs/in thickness) moisture vapor transmission
- 3.56 at 25 °C, 60 Hz (ASTM D-150) dielectric constant
- 0.012 at 25 °C, 60 Hz (ASTM D-150) dissipation factor
- Container Size: 12 lb/1 gal
- Dielectric Strength: 405 V/Mil (ASTM D-149, 1/8 Inch Specimen)
- Viscosity: 15500 - 24500 cps at 77 °F Brookfield (Mixed)
- Density: 12 - 13 lb/gal at 77 °F
- Thermal Conductivity: 3.5 BTU/HR/ft²/Inch/°F (ASTM 3111)
- Flexural Strength: 19900 psi (ASTM D790)
- Tensile Strength: 12000 psi (ASTM D-638)
- Viscosity: 15500 - 24500 cP
Applications
- Relays and Coils
- Capacitors
- Electronic Assemblies
- Battery Chargers
- Electronic Ballasts
- Hybrid Circuits
- Sensors
- Motors
- Transformers