text.skipToContent text.skipToNavigation

3M TC2810 Epoxy Adhesive, 37mL Dual Cartridge, White, 12/Case

ID: 3MADPTC2810 Mfr ID: 62266214352
Manufactured by: 3M Industrial Adhesives and Tapes
3M thermally conductive epoxy adhesive TC-2810 is a thermally conductive 2-part epoxy using boron nitride (BN) filler for good thermal conductivity with high adhesion.

USD $74.62 / PC

Buy more and save

1-23 $74.62 / PC
24-35 $67.59 / PC
36-47 $61.76 / PC
48+ $52.67 / PC

In Stock

 Future Availability 

This item may be sold in units of 1.

Order Form
  • Brand name :  3M
  • Series :  TC2810
  • Item Name :  Epoxy Adhesive
  • Short Desc :  ADHESIVE,THERM COND,3M TC2810 37ML D-PK
  • Packaging :  12/Case
  • UPC :  00048011651484
  • UNSPSC :  31201607

3M TC2810 Epoxy Adhesive, 37mL Dual Cartridge.

Design & Construction
Form - Part-A Paste 
Form - Part-B Paste 
Color - Part-A White 
Color - Part-B White 
Performance Details
Full Cure Time See TDS 
Shear Strength 2700 psi 
Electrical Properties
Dielectric Strength 750V/Mil 
Chemical Properties
Composition - Part-A Amine 
Composition - Part-B Epoxy Resin 
Specific Gravity - Part-A 1.34 
Specific Gravity - Part-B 1.44 
Viscosity - Part-A 150000 cP 
Viscosity - Part-B 150000 cP 
Physical Properties
Container Size 37mL 
Container Type Dual Cartridge 
Hardness 75 Shore D at 23 deg C, 80 Shore D at 90 and 120 deg C 
Odor/Scent - Part-A Epoxy 
Odor/Scent - Part-B Epoxy 

3M TC2810 Epoxy Adhesive, 37mL Dual Cartridge, White, 12/Case Safety Data Sheet (SDS) 

3M TC2810 Epoxy Adhesive, 37mL Dual Cartridge, White, 12/Case Technical Data Sheet 

Features :

  • High adhesive strength
  • Slight tack allows pre-assembly
  • Good surface wet out
  • Low viscosity for potting application
  • Good gap filling
  • Thin bonding line
  • Good thermal conductivity
  • Low CL ion content and outgassing

Applications :

  • For Thermal Material Potting, IC Packaging Heat Conduction, Heatsink-Thermal Interface Attachment, Battery Thermal Management, LED Lighting Thermal Management, Heatsink-Thermal Interface-Non Bonding