Typical applications of E-Solder 3025 are lead terminations, printed circuits and shielding on bases which will not withstand the elevated temperatures required for fired-on coatings or solders. E-Solder 3025 is an epoxy silver paste recommended for applications requiring low electrical resistance and good adhesive properties. E-Solder 3025 requires the addition of Hardener No. 18 to harden and cure. E-Solder 3025 may be cured at room temperature, however the application of heat will accelerate and shorten the cure time.