text.skipToContent text.skipToNavigation

Parker 50-01-1030-0000 Cho-Bond® One-Part Conductive Adhesive, 1 lb Cartridge, Gray

ID: CHOBOND103010 Mfr ID: 50-01-1030-0000
Manufactured by: EIS Supplier
Cho-Bond 1030 is a silver plated copper filled, one-component conductive silicone designed for applications where a flexible, strong, conductive electrical bond must be achieved. Cho-Bond 1030 greatly simplifies the problem of bonding conductive silicone EMI gaskets to metal substrates. It is formulated for relatively small bond lines (less than 0.01 Inch and should not be used as an EMI caulk where bond lines are greater than 0.1 Inch (0.25 mm).

USD $318.97 / PC

Check availability 

This item may be sold in units of 1.

  • Brand name :  Parker
  • Trade Name :  Cho-Bond®
  • Item Name :  Conductive Adhesive
  • Short Desc :  50-01-1030-0000 CHOBOND
  • UNSPSC :  31201600

No volatile organic compounds (VOCs) and minimal shrinkage upon curing make Cho-Bond 1030 a good choice for a variety of commercial and military applications. Cho-Bond 1030's moisture cure silicone polymer system allows it to cure to the touch in 24 hr and provides a robust conductive bond over a wide range of application temperatures.

Performance Details
Full Cure Time 1 Week 
Shear Strength 200 psi 
Design & Construction
Form Paste 
Color Gray 
Cure Type Room Temperature 
Environmental Condition
Temperature Rating -65 to 257 deg F 
Chemical Properties
Composition Silicone 
Specific Gravity
Physical Properties
Container Size 1 lb 
Container Type Cartridge 
Hardness 77 Shore D 

Parker 50-01-1030-0000 Cho-Bond® One-Part Conductive Adhesive, 1 lb Cartridge, Gray Technical Data Sheet 

Parker 50-01-1030-0000 Cho-Bond® One-Part Conductive Adhesive, 1 lb Cartridge, Gray Catalog 

Features :

  • Easy-to-use, no weighing or mixing required
  • Silver-plated copper filler
  • Good conductivity 0.05 ohm-cm
  • No VOCs
  • Minimal shrinkage
  • Moisture cure silicone
  • Flexible, 30 min working life, rapid skin formation
  • Non-corrosive cure mechanism
  • No corrosive by-products generated during curing to damage substrate
  • Can be used on overhead or vertical surfaces

Applications :