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Parker 50-02-0584-0029 Cho-Bond® Two-Part Conductive Adhesive, 2.5g Pack, Silver Gray

ID: CHOBOND058415 Mfr ID: 50-02-0584-0029
Manufactured by: EIS Supplier
Cho-Bond 584-29 is a two-component, silver filled conductive epoxy adhesive system designed for applications where a strong, highly conductive electrical bond must be achieved. Cho-Bond 584-29 is recommended for relatively small bond lines (less than 0.010 Inch (0.25 mm)), but can be used for larger bond lines in applications where vibration or potential for cracking is not an issue.

USD $25.70 / EA

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1-199 $25.70 / EA
200+ $21.42 / EA

In Stock

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This item may be sold in units of 1.

  • Brand name :  Parker
  • Trade Name :  Cho-Bond®
  • Item Name :  Conductive Adhesive
  • Short Desc :  50-02-0584-0029 CHOBOND 2.5-GM PKG
  • Packaging :  200/Carton
  • UNSPSC :  31201600

The fine silver filler of Cho-Bond 584-29 make it a good material choice for precise application in and around tight spaces and electrical components. Cho-Bond 584-29 comes in a variety of sizes and packaging so customers can choose a package and material size which is right for their application, minimizing material scrap and mixing issues.

Performance Details
Full Cure Time 24 hr 
Shear Strength 1200 psi 
Design & Construction
Form Paste 
Color Silver Gray 
Cure Type Room Temperature 
Environmental Condition
Temperature Rating -65 to 257 deg F 
Chemical Properties
Composition Epoxy 
Specific Gravity
Physical Properties
Container Size 2.5g 
Container Type Pack 
Hardness 80 Shore D 

Parker 50-02-0584-0029 Cho-Bond® Two-Part Conductive Adhesive, 2.5g Pack, Silver Gray Technical Data Sheet 

Parker 50-02-0584-0029 Cho-Bond® Two-Part Conductive Adhesive, 2.5g Pack, Silver Gray Catalog 

Features :

  • Fast heat cure, increases throughput and minimizes equipment downtime
  • Silver filler
  • Excellent conductivity 0.002 ohm-cm
  • 30 min working life, works well over wide temperature range, good chemical resistance, >1200 psi lap shear, good for permanently bonding surfaces
  • Multiple packaging options
  • No weighing required, mix and dispense in same package, minimizes process scrap
  • Thin paste
  • May be dispensed out of very small needles, fill small cracks and voids
  • Low VOC content
  • Minimal shrinkage

Applications :