MFR #:50-01-0360-0020
EIS #:CHOBOND03600020
MFR #:50-01-0360-0020
EIS #:CHOBOND03600020
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Min Qty:1
|Qty Increment:1
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Cho-Bond 360-20 is a two-component, silver plated copper filled conductive epoxy adhesive designed for applications where a strong, conductive electrical bond must be achieved. The silver copper filler of Cho-Bond 360-20 provides a cost effective alternative to pure silver filled conductive epoxies in applications where moderate conductivity is acceptable. - This thick paste is good for filling rather large bond lines and cracks (0.004 - 0.025 Inch) of electrical boxes and enclosures. Curing of Cho-Bond 360-20 can be achieved in as little as 15 min with heat to minimize equipment downtime and increase manufacturing throughput. The 1:1 weight mix ratio makes Cho-Bond 360-20 easy to handle and use.
$679.84 / Kit
Min Qty:1
|Qty Increment:1
more info
Cho-Bond 360-20 is a two-component, silver plated copper filled conductive epoxy adhesive designed for applications where a strong, conductive electrical bond must be achieved. The silver copper filler of Cho-Bond 360-20 provides a cost effective alternative to pure silver filled conductive epoxies in applications where moderate conductivity is acceptable. - This thick paste is good for filling rather large bond lines and cracks (0.004 - 0.025 Inch) of electrical boxes and enclosures. Curing of Cho-Bond 360-20 can be achieved in as little as 15 min with heat to minimize equipment downtime and increase manufacturing throughput. The 1:1 weight mix ratio makes Cho-Bond 360-20 easy to handle and use.
- Attributes
- Features
Attributes
General Information
Item NameConductive Adhesive
Trade NameCho-Bond®
General Features
Shelf Life9 Months
TypeTwo-Part
Design & Construction
ColorLight Gray
Cure TypeRoom Temperature
FormPaste
Performance Details
Shear Strength1600 psi
Full Cure Time24 hr
Chemical Properties
CompositionEpoxy
Specific Gravity1
Physical Properties
Container Size1 pt
Container TypeAluminum Can Kit
Hardness80 Shore D
Environmental Condition
Temperature Rating-80 to 212 °F
Features
- Fast heat cure, increases throughput and minimizes equipment downtime
- Silver-plated copper filler
- Low cost, good conductivity 0.005 ohm-cm
- 60 min working life, works well over wide temperature range, good chemical resistance >1600 psi lap shear, good for permanently bonding surfaces
- Gritty paste
- Thick paste, good for relatively large cracks and voids (> 0.25 Inch)
- No VOCs
- Minimal shrinkage, no permits or ventilation required
- Can be used on overhead or vertical surfaces