Dow Corning 3-6876 one-part heat cure (addition-curing) adhesives are typically cured at 212 °F or higher. Their cure rate is rapidly accelerated with heat (see cure schedules in table) and an optimum cure schedule will balance processing performance and costs. - For thicker sections or if voiding is observed the use of a 30 min precure at 70 °C (158 °F) or the use of an adhesive with low-void technology may reduce voids.