Macromelt - EIS,Maker of thermally conductive adhesives, potting and encapsulation products, and conformal coatings for the semiconductor packaging industry.

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Macromelt®

Henkel’s renowned Macromelt® low-pressure molding solution delivers superior sealing adhesion and excellent temperature and solvent resistance.

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Macromelt® Product Families

Circuit Board Protection

Low Pressure Molding

Low Pressure Molding

Low pressure molding solution delivers superior sealing adhesion and excellent temperature and solvent resistance. The simplicity of these materials is their advantage: because the entire Macromelt operation takes place at low pressure, cycle time is short and fragile circuitry is not damaged.