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Get more information about Hysol from EIS
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FIND OUT!Learn more about Hysol through the following resources:
http://www.henkelna
.com/electronics
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Hysol®
With a broad portfolio of materials including electrically conductive and non-conductive paste adhesives as well as CSP underfills and board protection materials, Hysol’s advanced formulations ensure maximum processability and reliable in-field performance.
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Hysol® Product Families
Printed Circuit Board Assembly Materials
- CSP Underfills
- Electrically & Non-Electrically Conductive Paste
- Chip-on Board (COB) Encapsulants
CSP Underfills
Highly flowable, high purity, one-component encapsulants. They form a uniform and void-free Underfill layer to improve the reliability performance by redistributing stress away from the solder interconnects as well as enhancing mechanical performance.
COB Encapsulants
Encapsulants are used to provide environmental protection and add mechanical strength to wire bonded devices. Two different application technologies: Glob top and Dam and Fill technology.
Circuit Board Protection Materials
- Potting Materials
- Conformal Coatings
- Sealants & Gasketing Materials
Potting Materials
Potting materials protect printed circuit boards and electrical devices by enhancing mechanical strength, offering electrical insulation, and protecting against vibration and shock.
Conformal Coatings
Used for spray, dip tank and brush applications. They protect printed circuit boards, components and flex circuitry from damage.
Sealants & Gasketing Materials
Silicone gasketing materials offer sealing for electronics enclosures, ensuring that housing modules are tightly secured and components are protected.