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SPOTLIGHT ON:Henkel-Hysol's E-40EXP™ Potting Compound
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http://www.henkelna
.com/electronics
Hysol®
Hysol® is a Henkel Brand. With a broad portfolio of materials including electrically conductive and non-conductive paste adhesives as well as CSP underfills and board protection materials, Hysol’s advanced formulations ensure maximum processability and reliable in-field performance.
Henkel-Hysol® Product Families
Printed Circuit Board Assembly Materials
- CSP Underfills*
- Electrically & Non-Electrically Conductive Paste
- Chip-on Board (COB) Encapsulants**
* CSP Underfills
Highly flowable, high purity, one-component encapsulants. They form a uniform and void-free Underfill layer to improve the reliability performance by redistributing stress away from the solder interconnects as well as enhancing mechanical performance.
**COB Encapsulants
Encapsulants are used to provide environmental protection and add mechanical strength to wire bonded devices. Two different application technologies: Glob top and Dam and Fill technology.
Circuit Board Protection Materials
- Potting Materials*
- Conformal Coatings**
- Sealants & Gasketing Materials***
*Potting Materials
Potting materials protect printed circuit boards and electrical devices by enhancing mechanical strength, offering electrical insulation, and protecting against vibration and shock.
**Conformal Coatings
Used for spray, dip tank and brush applications. They protect printed circuit boards, components and flex circuitry from damage.
***Sealants & Gasketing Materials
Silicone gasketing materials offer sealing for electronics enclosures, ensuring that housing modules are tightly secured and components are protected.